AMD Officially Shows Off Carrizo APU Sample Chip - Carrizo-L and Carrizo APUs Planned For 1H 2022

AMD Officially Shows Off Carrizo APU Sample Chip – Carrizo-Fifty and Carrizo APUs Planned For 1H 2022

In a video posted on AMD's official Youtube page, John Byrne, SVP and GM of AMD Computing & Graphics Business organisation Unit, showed off the first sample of their adjacent generation Carrizo APU. While most of the details regarding the upcoming APU are known, there were two key points mentioned by John, start that the AMD Carrizo APU volition be bachelor in 2 variants, Carrizo-L (entry level notebooks) and Carrizo (high functioning notebooks and All-In-Ones). Secondly, both variants of Carrizo are launching in the first half of 2022 and AMD already has working samples of both chips at their workplace.

AMD Shipping Carrizo APU in 1H 2022 - Features Excavator and Improved GCN Cores

While AMD won't release the more juicy details until ISSCC 2022 that's happening in February 2022, it's prissy to finally hear something official on Carrizo APU and seems like most of the details we accept known so far are legit. AMD is going to launch Carrizo in two variants, Carrizo-L will exist the entry level and mainstream notebook chip while the Carrizo APU for high-functioning and AIO products will exist known equally Carrizo. Some rumors do point to the desktop variant being called Carrizo-D just AMD didn't fifty-fifty mention about the desktop platform in the video only we already take some details equally to what'due south it all nearly. Another primal thing told by John was that AMD Carrizo APU and Carrizo-50 APU volition be platform compatible and available in BGA form factor. The main departure between with Carrizo and Carrizo-L is that Carrizo volition ship with Excavator cores while Carrizo-L will feature PUMA+ Cores. The desktop part will be on FM2+. However the video did ostend that in that location isn't going to be whatsoever sort of HBM or stacked DRAM technology available on Carrizo and then we take to wait a bit longer to see that in action. Nevertheless, details from couple of days agone will give you a roundup of all the information nosotros know about Carrizo so far.

The 28nm Carrizo APU volition measure at 244.62 mm2 and pack 3.i Billion transistors. For comparison, AMD's Kaveri APU packed 2.41 Billion transistors on a 245 mm2 die and was based on a 28nmSHP procedure from GlobalFoundries. The increased number of the total transistors could be due to two things, the new Excavator architecture and the employ of new GCN graphics engineering on Carrizo. Before nosotros go into details, exercise read the post-obit annotation:

AMD will disclose Carrizo, an integrated processor with its latest x86 cadre. The 28 nm bit measures 244.62 mmⁱⁱ and packs more 3.one billion transistors. Its new Excavator core is 23% smaller and uses 40% less power than AMD's previous x86 core.

Details we already know about Carrizo are that the APU would go the 5th installment in the Accelerated Processing Units family unit which will feature the latest Excavator core architecture. Powering the CPU side, these new x86 Excavator modular cores will leverage the IPC for greater performance compared to Steamroller. The mobile platform will feature both Quad Core and Dual Core variants merely correct at present, we are looking at a glimpse of the top-finish variant which shares 2 MB L2 cache. According to the official statement, the Excavator core will be 23% smaller and swallow 40% lesser power than Kaveri APU. With the CPU die beingness small, it volition give AMD more room to increase the GCN GPU die on the APU.

"We continue to introduce and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Calculating and Graphics business group, AMD. "AMD's commitment to graphics and compute functioning, equally expressed past our goal to improve APU energy efficiency 25x past 2022, combines with the latest industry standards and fresh innovation to bulldoze the blueprint of the 2022 AMD Mobile APU family. We are excited nearly the experiences these new APUs will bring and look forrad to sharing more than details in the first half of adjacent year."

The flagship "Carrizo" processor will integrate the new x86 CPU core codenamed "Excavator" with adjacent generation AMD Radeon™ graphics in the world'southward first Heterogeneous Systems Architecture (HSA) 1.0 compliant SoC. The "Carrizo-L" SoC integrates the CPU codenamed "Puma+" with AMD Radeon™ R-Series GCN GPUs and is intended for mainstream configurations. In addition, an AMD Secure Processor will be integrated into the "Carrizo" and "Carrizo-L" APUs, enabling ARM®TrustZone® across the entire family for the security commercial customers and consumers await. Utilizing a single bundle infrastructure for "Carrizo" and "Carrizo-L," the 2022 AMD Mobile APU family unit simplifies partner designs across a broad range of commercial and consumer mobile systems.

"Carrizo" and "Carrizo-L," are scheduled to transport in 1H 2022, with laptop and All-in-One systems based on the 2022 AMD Mobile APU family expected in market by mid-year 2022. via AMD

Prior to this leak, rumors revealed that Carrizo will feature 30% performance increase over Kaveri generation of processors which we thought was pure speculation at best but the slide clearly mentions a 30% increase at only 15W power input which is pretty impressive. Additionally, AMD will also add AVX2, BMI2, MOVBE and RDRAND support to the instruction set which brings the extension characteristic ready close to Intel'due south Haswell. Since the targeted platforms for these APUs are notebooks, all-in-ones and convertibles, they will exist shipped in BGA )FP4) packet and will ship in variants ranging in TDPs of 12/15/35W. The desktop variants will be rated at a ability depict of 40/45/65W.

On the GPU side, we have the 3rd Generation GCN (Volcanic Islands) core which is a great plus betoken for this level of APU. You should keep in heed that the Volcanic Islands graphics isn't the codename for AMD'due south Radeon R200 lineup merely infact used to announce their flagship Hawaii based chips. The integrated graphics would still be based on the 28nm process and its hard to say whether the Compute Unit count will increase in the Carrizo APU generation of products. We volition definitely encounter an improved and efficient design which volition let faster clock speeds on these slap-up integrated chips which make many upcoming games run off without the demand of a discrete graphics card at decent item quality.

The graphics die will notwithstanding feature 8 Compute Units which denote 512 stream processors forth with higher memory efficiency which volition deliver improve performance throughput since APUs are generally bandwidth starved, Delta color pinch and feature full HSA support with a loftier-performance integrated passenger vehicle for graphics and DRAM along side some software enhancements such as Fine-grain preemption for context switches and in add-on to Pall, feature support for DirectX 12 API likewise. Information technology remains to exist seen if the faster desktop variants will get an updated die since reports have alleged that features from Tonga will be derived in the latest installment of  APUs. This could mean several things, the features on Tonga such as color compression and memory bandwidth optimizations could exist in place along with better XDMA Dual graphics support plus the addition of more stream processors and GCN Compute units.

The most interesting thing about Carrizo, aside from its technical specifications is also the design of the chip itself. AMD for the first time is aiming for a truthful SOC design eliminating the demand of a separate FCH as was the case with Kaveri mobile which requires Bolton FCH for boosted connectivity options. The FCH volition be integrated on the die itself which will deliver Security, Display, Audio, PCI-e, SATA, SD, USB, Multimedia, UART/12C. CLCKGen and Misc I/O connectivity. AMD is aiming for UVD6, VCE3 and a audio co-processors with H.264 encode while feature a display control engine "DCE11″. With HDMI ii.0 that provides up to iii display interfaces and PCI-e Gen 3.0 x8 for discrete GPU expansion and PCI-due east 3.0 x4 for GPP, the APU begins to look like a decent improvement over Kaveri from a blueprint perspective.  The FCH can deliver 4 USB 3.0 / 2.0 ports, 4 USB 2.0 ports and ii SATA three ports while the memory controller let for Dual Aqueduct DDR3 retention rated at 2133 MHz in SoDIMM form cistron (One per channel).

The mobile platform is targeted as a SOC while desktop chips will be compatible with FM2+ socket with the A88X "Bolton" FCH. Some early on specifications take been leaked which we have detailed in an article here.

AMD Carrizo APU Comparison Nautical chart:

	AMD Trinity APU	AMD Richland APU	AMD Kaveri APU	AMD Carrizo-L	AMD Carrizo APU
Core	x86 Piledriver	x86 Piledriver	x86 Steamroller	x86 PUMA+	x86 Excavator
Cores	ii-iv	ii-four	2-4	2-4	ii-iv
GPU	HD 7000 VLIW4	HD 8000 VLIW4	2nd GCN Sea Islands	2nd GCN Sea Islands	3rd GCN Volcanic Islands
GCN Cores	384 SPs	384 SPs	512 SPs	128 SPs?	512 SPs
Chipset	A85X/A75/FCH	A88X/A78/FCH	A88X/A78/Bolton	SOC	A88X/A78/SOC
Socket	FM2/FM2+/BGA	FM2/FM2+/BGA	FM2+/BGA	BGA	FM2+/BGA
Memory	DDR3	DDR3	DDR3	DDR3	DDR3
TDP	17/25/35W	17/25/35W	17/nineteen/35W	10/25W	15-35W
HSA Support	No	No	Yeah	Yes	Full HSA ane.0

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Source: https://wccftech.com/amd-officially-shows-carrizo-apu-sample-chip-carrizol-carrizo-apus-planned-1h-2015/

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